When a multi-die package worth $500 fails final test because of a defect that originated three process steps earlier, the economics of advanced packaging become painfully clear. Each excursion carries ...

According to a recent analysis by Towards Packaging, the global semiconductor assembly packaging equipment market is projected to expand from USD 5.35 billion in 2026 to USD 11.11 billion by 2034, ...

Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution ...

The role of packaging/assembly/test (P/A/T) in the overall successful commercialization of MEMS (microelectromechanical systems) has historically taken a backseat to device development. In the ...

The motion control market is expanding from $16 billion in 2024 to a projected $23 billion by 2031, driven by AI-powered adaptive systems and smart conveyance technology that automatically optimize ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...